(kicad_pcb (version 20211014) (generator pcbnew) (general (thickness 1.6) ) (paper "A4") (layers (0 "F.Cu" signal) (1 "In1.Cu" signal) (2 "In2.Cu" signal) (31 "B.Cu" signal) (32 "B.Adhes" user "B.Adhesive") (33 "F.Adhes" user "F.Adhesive") (34 "B.Paste" user) (35 "F.Paste" user) (36 "B.SilkS" user "B.Silkscreen") (37 "F.SilkS" user "F.Silkscreen") (38 "B.Mask" user) (39 "F.Mask" user) (40 "Dwgs.User" user "User.Drawings") (41 "Cmts.User" user "User.Comments") (42 "Eco1.User" user "User.Eco1") (43 "Eco2.User" user "User.Eco2") (44 "Edge.Cuts" user) (45 "Margin" user) (46 "B.CrtYd" user "B.Courtyard") (47 "F.CrtYd" user "F.Courtyard") (48 "B.Fab" user) (49 "F.Fab" user) ) (setup (pad_to_mask_clearance 0) (aux_axis_origin 84.8093 127.0786) (grid_origin 84.8093 127.0786) (pcbplotparams (layerselection 0x00010fc_ffffffff) (disableapertmacros false) (usegerberextensions false) (usegerberattributes true) (usegerberadvancedattributes true) (creategerberjobfile true) (svguseinch false) 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(Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator") (tags "capacitor handsolder") (property "Sheetfile" "Драйвер IGBT.kicad_sch") (property "Sheetname" "") (path "/83f246f2-562e-45db-bc42-34aeed8be9d4") (attr smd) (fp_text reference "C3" (at -2.6 0 180) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15))) (tstamp 6d8d629a-6303-43de-a40a-aaf8a451bbf3) ) (fp_text value "1n" (at 0 1.68 90) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15))) (tstamp 1852d03c-ef4b-40b1-96ab-ed33811f661e) ) (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab") (effects (font (size 0.5 0.5) (thickness 0.08))) (tstamp 72e83158-7ca3-42fe-bf23-6759e5cb5075) ) (fp_line (start -0.261252 0.735) (end 0.261252 0.735) (layer "F.SilkS") (width 0.12) (tstamp 04a9afa7-69b6-4ad9-8c98-02e6023f8500)) (fp_line (start -0.261252 -0.735) (end 0.261252 -0.735) (layer "F.SilkS") (width 0.12) (tstamp e571d874-716b-4d9c-96cc-ccaeaa1efa28)) (fp_line (start -1.88 0.98) (end -1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp 22260e2e-af7a-4097-b752-818be707cb91)) (fp_line (start -1.88 -0.98) (end 1.88 -0.98) (layer "F.CrtYd") (width 0.05) (tstamp 2b89f44b-e8ae-4b2e-a6ae-5128db5f6e78)) (fp_line (start 1.88 0.98) (end -1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp 5105a459-128a-4766-8179-a77dbf194e3a)) (fp_line (start 1.88 -0.98) (end 1.88 0.98) (layer "F.CrtYd") (width 0.05) (tstamp bf11d6e8-fbcf-48a2-b959-55952f298e65)) (fp_line (start 1 0.625) (end -1 0.625) (layer "F.Fab") (width 0.1) (tstamp 3323e157-65fc-43dc-9b6d-b1470b444915)) (fp_line (start -1 0.625) (end -1 -0.625) (layer "F.Fab") (width 0.1) (tstamp a48a3834-b302-4c0b-a025-fb20bd1d7b96)) (fp_line (start 1 -0.625) (end 1 0.625) (layer "F.Fab") (width 0.1) (tstamp d637ec8a-3260-457f-b22f-46781fce308f)) (fp_line (start -1 -0.625) (end 1 -0.625) (layer "F.Fab") (width 0.1) (tstamp f7611e6b-01c2-456b-b25a-41fd12fafeb9)) (pad "1" smd roundrect (at -1.0375 0 270) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766) (net 10 "Measure") (pintype "passive") (tstamp 68a3e8cf-948e-4670-82d7-8f6b643c1c61)) (pad "2" smd roundrect (at 1.0375 0 270) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766) (net 11 "GNDA") (pintype "passive") (tstamp 2bb13d74-6d85-45f2-8b22-58f81043df13)) (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl" (offset (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) ) (footprint "Capacitor_SMD:C_1210_3225Metric_Pad1.42x2.65mm_HandSolder" (layer "F.Cu") (tedit 5B301BBE) (tstamp 00000000-0000-0000-0000-000060dcc41e) (at 139.2923 83.8986 90) (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. 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